Tin Plating Services in Chicago, IL
Tin Plating – A Reliable Choice
Sterling Plating provides several tin plating options including:
• Lead-Free Matte
Lead-Free Tin Plating
What is Tin Plating? Lead-free tin is a soft metal that provides superior electrical conductivity and corrosion protection. The method of plating is often used to preserve the solderability of under-plated deposits such as copper or nickel. At least 100 grams of contact force is recommended when using lead-free tin in a contact application. We can recommend always utilizing a sliding or wiping action during contact engagement in lead free tin plated connector applications. Our lead-free tin deposits meet all RoHS requirements.
- Lead-Free Bright Tin PlatingSpecifications: ASTM B545, MIL-T-10727Lead free bright tin exhibits cosmetic reflectivity and is typically used in electrical contact applications such as terminals and switching components that will not be used in solder applications. Because bright tin requires the use of organic additives that co-deposit, it is not appropriate for projects necessitating solderability.
Sterling offers lead free bright tin plating in each of the following segments of our capabilities:
- Lead-Free Matte Tin PlatingSpecifications: ASTM B545, MIL-T-10727Lead-free matte tin is appropriate for all connector applications. Because matte tin deposits do not contain organic materials, this method is superior to that of bright tin in solderability applications.
Sterling Plating offers Lead Free Matte Tin Plating in each of the following segments of our capabilities:
Matte and Bright Tin Lead Plating
Specifications: AMS-P-81728, ASTM B579, MIL-P-81728
Alloying matte and bright tin with lead reduces the melting point, which is favorable for applications when solderability is important. This process also prevents the formation of tin whiskers. All other performance characteristics of bright tin are similar to that of pure tin. Neither plating methods meet RoHS requirements.
Sterling Plating offers Matte and Bright Tin plating in each of the following segments of our capabilities: